LaXense’s micro lens array products are fabricated by semiconductor wafer processing technology which guarantees low cost and high volume manufacturability. LaXense developed optimized processes of making these micro lenses or lens arrays with accurate diameter, radius of curvature, pitch (for array case), and minimal defects and surface roughness. Single layer or multi-layer anti-reflection coating (ARC) is available to meet customers’ requirement. A variety of combinations of lens diameter and radius of curvature are possible with custom orders. The baseline design is spherical lens while aspheric lens is also available with adjusted processes. For lenses made of silicon, the large refractive index of silicon reduces optical aberrations and produces good optical performance even with spherical lens design.
Low cost wafer processing technology
- Wide range of lens parameters
- Precise chip dimension
- Capable of metal fiducial marks
- Capable of alignment structures
- Capable of customization
- Laser – fiber/waveguide coupling
- PD – fiber/waveguide coupling
- Multi-channel parallel optics
- Other special/proprietary applications
硅透镜
Description
LaXense’s micro lens array products are fabricated by semiconductor wafer processing technology which guarantees low cost and high volume manufacturability. LaXense developed optimized processes of making these micro lenses or lens arrays with accurate diameter, radius of curvature, pitch (for array case), and minimal defects and surface roughness. Single layer or multi-layer anti-reflection coating (ARC) is available to meet customers’ requirement. A variety of combinations of lens diameter and radius of curvature are possible with custom orders. The baseline design is spherical lens while aspheric lens is also available with adjusted processes. For lenses made of silicon, the large refractive index of silicon reduces optical aberrations and produces good optical performance even with spherical lens design.
Features
· Low cost wafer processing technology
Wide range of lens parameters
Precise chip dimension
Capable of metal fiducial marks
Capable of alignment structures
Capable of customization
Applications
Laser – fiber/waveguide coupling
PD – fiber/waveguide coupling
Multi-channel parallel optics
Other special/proprietary applications
参数
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